International Journal of Modeling, Simulation and Applications invites original papers in the research areas of modeling and simulations of various aspects of devices, analysis and implementation in digital and analog circuit applications. Prediction and optimization through modeling forms the basis of engineering design. A brief communication for rapid publication of short articles announcing significant and original results are also invited.

• Design and Simulation of Devices and Circuits
• Modeling of Solid State Devices
• Organic/Polymer Electronics
• Pre- and Post-Fabrication/Processing of Data Analysis
• Modeling and Simulation of FinFETs, MOSFETs, CMOS, Tunnel-FETs
• Silicon Nanowires
• Simulation of Dual gate, Vertical Channel and Cylindrical Gate MOSFET/OTFTs
• Modeling of Circuit Networks, Analogue and Digital Circuits
• Modeling and Simulation p and n-Channel Organic Thin Film Transistors (OTFTs)
• Modeling and Simulation p and n-Polymer Thin Film Transistors (PTFTs)
• Modeling and Simulation Thin Film Transistors (TFTs)
• Modeling and Simulation Organic Novel Device Structures
• Modeling and Simulation of Novel Circuits
• Analytical Models for Organic Devices
• Mixed Mode Circuit Simulations
• Optimization of Device Performance Parameters
• Modeling and Simulation of Organic Light Emitting Diodes (OLEDs)
• Modelling and Simulation of Organic Solar Cells
• Novel Optoelectronic Devices
• Organic Device Applications
• Organic Electronic Emerging Technologies
• Modeling and Simulations Device Circuit Co-design
• Physics and Modeling of Submicron and Nanoscale Microelectronic and Optoelectronic Devices Including Processing, Measurement, and Performance evaluation
• Applications of Numerical Methods to the Modeling and Simulation of Devices and Processes
• Nanoscale Electronic and Optoelectronic Devices
• Photovoltaics and Sensors System Design
• Mathematical Models of Novel Electronic Device Structures

• Submission Deadline : September 17, 2022
• Notification : October 17, 2022
• Final Manuscript Due : October 25, 2022
• Publication Date : Determined by the Editor-in-Chief